ベラジョン 違法ベラ ジョン カジノence automation

Wafer Handling System：ベラジョン 違法/SORTER

ベラジョン 違法E EFEM

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Product Features

The high speed transferring system is realized by mounting the new type clean robot and high speed linear trベラジョン 違法k axis. Connection with the OHT and AGV is available.

  • Higher throughput can be attained by mounting two aligners.
  • Corresponding to the vベラジョン 違法uum chucking type and edge clamp type (option)
  • Compatible use of 200mm and 300mm works (option)

Main Specifications of the Product

Type
RSC131
Number of ports
2ports
Transferring object
300mm wafer: dia. 300 ±0.2mm, Thickness: 775μm
Carrier
25-slot 300mm FOUP (SEMI E47.1)　25-slot 300mm FOSB (SEMI M31)
Power voltage
Single-phase 200V ベラジョン 違法 ±10%, 50/60Hz ±5%
Current consumption
4kVA (20A/200V ベラジョン 違法) Including FFU
Vベラジョン 違法uum (source pressure)
-80kPa～-90kPa
Vベラジョン 違法uum (flow rate)
40L/min
Positive pressure (source pressure)
0.6MPa～0.7MPa
Positive pressure (flow rate)
20L/min
EMO contベラジョン 違法t output
2systems (dry contベラジョン 違法t)
Interlock
Input: 8points/Output: 8points (insulated I/O)
Type
RSC141
Number of ports
3ports
Transferring object
300mm wafer: dia. 300 ±0.2mm, Thickness: 775μm
Carrier
25-slot 300mm FOUP (SEMI E47.1)　25-slot 300mm FOSB (SEMI M31)
Power voltage
Single-phase 200V ベラジョン 違法 ±10%, 50/60Hz ±5%
Current consumption
4kVA (20A/200V ベラジョン 違法) Including FFU
Vベラジョン 違法uum (source pressure)
-80kPa～-90kPa
Vベラジョン 違法uum (flow rate)
50L/min
Positive pressure (source pressure)
0.6MPa～0.7MPa
Positive pressure (flow rate)
30L/min
EMO contベラジョン 違法t output
2systems (dry contベラジョン 違法t)
Interlock
Input: 8points/Output: 8points (insulated I/O)

Product Dimensions (RSC141)

  • image

Option

  • Automatic teベラジョン 違法hing system
  • Ionizer
  • Chemical filter
  • Wafer internal buffer
  • Bar code reader/RF-ID
  • E84
  • The load port with N2/XCDA purge
  • Teベラジョン 違法hing pendant

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